Never like this year this fair will be characterized by a marked transversal nature, analyzing the opportunities linked to the evolution of production processes in a circular perspective which, together with sustainability and energy saving, will represent the key...
Present on the market for 23 years, Remac was born as a labor services company for companies in the sector, and then dedicated itself from 2002 to building of mixers for adhesives and finally from 2006 to building of...
On the strength of highly significant economic and financial results and on the eve of a second half of 2023 which will see the launch of technological solutions for the label market at Labelexpo and for corrugated cardboard at...
The new Sei Laser Converting Competence Park was inaugurated with all the technologies of the leader in die-cutting solutions for labels and packaging converting, obviously using lasers with an interesting focus that compared two apparently competitive technologies, such...
On 16th May 2023 OMET held an open house dedicated to printing solutions for flexible packaging at the new Innovation Park, its permanent showroom in Molteno. Over 60 professionals and operators of the sector attended the event with live...
With a great event that was held last May 11 at the Converdrome of Colognola ai Colli (Vr), the entire Uteco management welcomed almost 200 visitors from all over the world for the launch of the new OnyxGO, of...
Three days of open house for Gallus, which on the occasion of the celebration of the 100th anniversary of the Group invited its customers from 21 to 23 June to its headquarters in St. Gallen in Switzerland for the...
We are publishing a comprehensive preview of the technological innovations that will be available to see and experience at Labelexpo 2023, taking place in Brussels from September 11th to 14th: 4 days of event, 9 pavilions, over 600 exhibitors,...
WEPACK (World Expo of Packaging Industry) 2023 is scheduled to be held on July 12-14: the event will be as a forward-looking, exploratory and influential super gala that covers the entire industry chain of packaging worldwide together with these...
With an event at its headquarters in Altstätten in Switzerland, on April 19 and 20 Zünd presented the new Q-Line with Board Handling System BHS180 and Undercam, redefining the standards of “pallet-to-pallet” digital converting. A top-of-the-range technology that does...
